FR-100 Flux Remover
Flux remover that removes water-soluble flux residues after reflow, used with DI water
Learn moreProducts
Chemicals for cleaning, stripping, plating and coating in semiconductor packaging and electronic component processes.
Listed in packaging process order. Select a step to narrow the list.
Search by name, code or application, or narrow the list by process and material.
11 products
FR-100 Flux remover that removes water-soluble flux residues after reflow, used with DI water
Learn moreEL Grade IPA and acetone for cleaning, degreasing and residue removal in semiconductor and electronics processes
Learn moreCleaning solution for epoxy and organic contamination on dispensing valves in packaging (H/S/A, LID/A)
Learn moreACT-70 Acid descaler for removing oxide film from copper and copper alloy surfaces
Learn moreDedicated cleaner for scum, sludge, scale and inorganic salts in DFR developing and stripping equipment
Learn morePRO-2000RE · CSS-100H Tin and solder strippers for lead frame rework and plating carriers — no base metal attack
Learn moreCHS-300 High-speed pure tin plating process for IC packages and electronic components (High Speed Matte)
Learn moreEX-Deflasher Deflasher removing mold flash (resin bleed) and oil from lead frames before acid tin plating
Learn moreLAP 300 Alkyl phosphate-based anti-rust and antistatic treatment agent
Learn moreCDR-10T · CDR-50AS Alkaline strippers that remove dry film and photoresist without damaging the substrate
Learn moreLG-200 Water-soluble coating that prevents chipping, thermal stress and debris in laser sawing
Learn moreNo products match. Tell us your process and we will recommend a suitable product. Request a Quote