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LG-200 Laser Grooving Coating Solution

Water-soluble coating that prevents chipping, thermal stress and debris in laser sawing

Request a Quote Request TDS / MSDS

02Overview

LG-200 is a laser grooving coating solution designed with accumulated technology and made of environmentally friendly materials. It prevents debris on the wafer surface during laser sawing, and protects against chipping and thermal stress.

It offers excellent washability and thermal stability, forms a strong coating film, and leaves a clean, dry surface after DI water cleaning.

03Features & Benefits

  • 01Strong cleaning, bump protection

    Reduces stains and protects bump balls from corrosion.

  • 02Completely removed by DI water
  • 03Quick drying

    Dries the wafer quickly and completely.

  • 04Bubble-free materials
  • 05Stable against temperature change

    Applies uniformly and stays stable as temperature changes.

  • 06No odor, RoHS, halogen-free

04Applications

Where it fits in wafer dicing
  1. 1 PROTECTIVE COATING – LG-200 Water-soluble coating on the wafer before laser processing
  2. 2 LASER GROOVING Laser grooving of the surface layer — chipping, thermal stress and debris prevented
  3. 3 BLADE DRESSING Correct blade geometry and sharpen the dicing blade Dressing Board
  4. 4 BLADE DICING Cut into individual dies with the blade
  5. 5 DI WATER CLEANING – LG-200 Remove the coating with DI water and dry

Based on a typical process flow. Actual sequence and conditions vary by customer process.

  • Wafer laser grooving
  • Laser saw process
  • Solder-bumped wafers

05Specifications

AppearanceTransparent liquid
Evaluation condition25 ℃

06Operating & Handling

RemovalDI water cleaning

07Packaging & Storage

Details are being prepared. Please request the TDS for exact values.

08Inquiry & Documents

Opens the quote form with this product pre-filled. You can request the TDS or MSDS through the same form.

Request a Quote — LG-200 Request TDS / MSDS

Tel +82-32-222-0600~1 · E-mail sjahn@chemtechi.com

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