Skip to content
ChemTech International 켐텍 인터내셔날
Blog

Process Chemicals Flagship

FR-100 Flux Remover

Flux remover that removes water-soluble flux residues after reflow, used with DI water

Request a Quote Request TDS / MSDS
FR-100 Flux Remover

02Overview

FR-100 is a high-performance flux remover specifically formulated to remove water-soluble flux residues when used with DI water. It achieves outstanding cleaning performance through our advanced and field-proven technology.

It is specifically developed for optimal performance in advanced packaging processes, and offers a competitive advantage in cost efficiency while delivering superior quality and reliability.

It has been proven and used by major OSAT companies for over 10 years.

03Features & Benefits

  • 01Strong cleaning power

    Removes flux residue without oxidizing solder bumps.

  • 02Completely removed by DI water

    Hydrophilic formulation rinses away fully with DI water cleaning.

  • 03Very mild odor

    Low odor burden in the working environment.

  • 04Minimal micro-bubbles

    Composed of materials that minimize micro-bubbles (foam).

  • 05Low usage, competitive cost

    Low consumption keeps operating costs down.

  • 06Eco-friendly, RoHS, halogen-free

    Made of eco-friendly materials; meets RoHS regulation and halogen-free requirements.

SEM — before and after cleaning

Before flux cleaning
Before flux cleaning
After flux cleaning
After flux cleaning

04Applications

FR-100 Application in Semiconductor Package Assembly FR-100 effectively removes flux residues from surfaces and fine gaps after reflow, providing a clean surface for subsequent assembly processes.
  • Flip Chip
  • FCBGA
  • SiP
  • Ball Attach
  • Advanced Semiconductor Packaging
  1. 1 FLUX APPLICATION Dispense a controlled amount of flux on the joints
  2. 2 DIE PLACEMENT Align and place the chip on the substrate bonding site
  3. 3 REFLOW Melt the solder to join the chip or component to the substrate
  4. 4 DEFLUX CLEANING – FR-100 Remove flux residue left on surfaces and in fine gaps after reflow
  5. 5 SUBSEQUENT ASSEMBLY PROCESS Underfill, molding, ball attach, etc. depending on package structure
  6. 6 INSPECTION & TEST Visual and electrical inspection
  7. 7 MARKING & PACKING Product marking and final packing

Applicable to semiconductor packaging processes requiring post-reflow flux residue removal.

05Specifications

ComplianceRoHS · Halogen-free

06Operating & Handling

Cleaning methodUsed with DI water

07Packaging & Storage

Details are being prepared. Please request the TDS for exact values.

08Inquiry & Documents

Opens the quote form with this product pre-filled. You can request the TDS or MSDS through the same form.

Request a Quote — FR-100 Request TDS / MSDS

Tel +82-32-222-0600~1 · E-mail sjahn@chemtechi.com

Other products in this category

Process Chemicals