Process Chemicals

`CHS-300` Pure Tin Plating

Name: CHS-300 Pure Tin Plating
Brand: ChemTech International
SKU: CHS-300

High-speed pure tin plating process for IC packages and electronic components (High Speed Matte)

CHS-300

02Overview

CHS-300 is a high-speed semi-matte pure tin plating process developed for IC packages and electronic components.

01Lead-free organic acid bath
Suitable for lead-free methanesulfonic acid (MSA)-based baths.
02Wide current density range
Provides uniform deposits over a wide current density range.
03Semi-matte pure tin
Produces semi-matte pure tin deposits.
04Minimized whiskers
Minimizes the occurrence of tin whiskers.
05Low carbon content
Achieves deposits with low carbon content.
06Excellent solderability
Provides deposits with excellent solderability.

Where it fits in a lead frame package plating line

1 MOLDING · PMC EMC molding and post-mold cure
2 DEFLASH Remove mold flash and resin bleed from leads EX-Deflasher
3 DESCALE Remove heat-induced oxide film and scale, activate surface ACT-70
4 PURE TIN PLATING – CHS-300 High-speed pure tin plating on leads
5 INSPECTION Plating appearance and thickness inspection
6 REWORK STRIPPING Strip rejected deposits without base metal attack, then re-plate PRO-2000RE

CARRIER CLEANING – CSS-100HStrip tin build-up from plating carrier belts and racks

Based on a typical process flow. Actual sequence and conditions vary by customer process.

Deposit	Semi-matte pure tin
Bath	Lead-free organic acid (MSA) bath

Details are being prepared. Please request the TDS for exact values.

Details are being prepared. Please request the TDS for exact values.

Opens the quote form with this product pre-filled. You can request the TDS or MSDS through the same form.

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