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Process Chemicals

CDR-10T · CDR-50AS Photo Resist Remover

Alkaline strippers that remove dry film and photoresist without damaging the substrate

02Overview

A product family for stripping water-soluble dry film and photoresist, designed not to affect copper, tin and solder-plated surfaces or aluminum substrates.

CDR-10TAlkaline Photo Resist Remover

CDR-10T is an alkaline remover for water-soluble dry film, liquid resist and photoresist ink. On copper, tin and solder plating it does not affect the material thanks to its anti-oxidation and corrosion protection, and it penetrates easily between high-density fine-pitch lines, splitting the film for fast stripping.

  • Clean, bright surface with no oxidation — easy AOI and visual inspection
  • Simple replenishment and easy maintenance
  • Applicable to immersion and spray types
TankHeat-resistant PVC (above 50 ℃), polypropylene
HeaterTeflon, titanium
Spray equipmentStainless steel or heat-resistant plastic
NozzleCone and fan-type nozzles recommended for maximum stripping efficiency
PumpAt least 1.0 psi pressure evenly distributed
CDR-50ASDry Film Stripper

CDR-50AS removes dry film without residue or traces. It is designed to be used without attacking aluminum substrates, strips film completely by dipping alone, and suits high-speed equipment with spray foaming.

  • High-speed stripping
  • No discoloration of copper or aluminum
  • No damage to metal surfaces
  • No stains after treatment
  • Can be diluted on its own or used as an additive in some applications
TankPolypropylene or steel
HeaterStainless steel or Teflon coated

03Features & Benefits

Overview ↑

04Applications

Where it fits in the DFR photo process
  1. 1 DFR LAMINATION Dry film lamination
  2. 2 EXPOSURE Circuit pattern exposure
  3. 3 DEVELOPING Develop away unexposed film
  4. 4 ETCHING / PLATING Etch or plate along the pattern
  5. 5 DFR STRIPPING – CDR-10T · CDR-50AS Strip remaining dry film and photoresist
  6. 6 EQUIPMENT CLEANING Periodic cleaning of scum, sludge and scale in developing and stripping equipment Equipment Cleaner

Based on a typical process flow. Actual sequence and conditions vary by customer process.

  • Water-soluble dry film and photoresist ink stripping
  • High-density fine-pitch circuits
  • Copper, tin and solder-plated surfaces
  • Aluminum substrates (CDR-50AS)
  • Immersion, spray and high-speed equipment

05Specifications

Details are being prepared. Please request the TDS for exact values.

06Operating & Handling

MethodImmersion · spray
EquipmentSee the equipment table of each product

07Packaging & Storage

Details are being prepared. Please request the TDS for exact values.

08Inquiry & Documents

Opens the quote form with this product pre-filled. You can request the TDS or MSDS through the same form.

Tel +82-32-222-0600~1 · E-mail sjahn@chemtechi.com