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Mold Release Film
Release film that protects the mold in EMC transfer molding and peels off cleanly after curing
02Overview
Mold Release Film is a release film for semiconductor molding, composed of a matt PET film and an adhesive layer.
It attaches evenly without wrinkles before molding, prevents mold compound penetration during the process, keeps its performance at molding temperatures of 150 ~ 180 ℃ and above, and separates cleanly without residue after curing.
03Features & Benefits
- 01Uniform attachment
Attaches evenly without wrinkles before molding and prevents mold compound penetration during the process.
- 02Heat resistance
Maintains performance at molding temperatures (150 ℃ ~ 180 ℃ and above).
- 03Clean release
Peels off cleanly without residue or contamination.
04Applications
- 1 TAPE LOAD – Mold Release Film Feed mold release tape between the molds
- 2 VACUUM SUCTION – Mold Release Film Vacuum holds the film flat against the mold
- 3 EMC TRANSFER MOLDING EMC injection and molding (150 ~ 180 ℃ and above)
- 4 REMOVE AFTER CURING – Mold Release Film Peel off the film cleanly after curing
Transcribed from the four-step process figure in the product brochure.
- EMC transfer molding
- Lead frame package molding
05Specifications
| Structure | Matt PET film + adhesive layer |
|---|---|
| Heat resistance | Maintains performance at 150 ℃ ~ 180 ℃ and above |
06Operating & Handling
Details are being prepared. Please request the TDS for exact values.
07Packaging & Storage
| Form | Roll |
|---|
08Inquiry & Documents
Opens the quote form with this product pre-filled. You can request the TDS or MSDS through the same form.
Tel +82-32-222-0600~1 · E-mail sjahn@chemtechi.com