Semiconductor Process Materials Flagship

`Resin Bond · Vitrified Bond` Dicing Blade Dressing Board

Dressing boards for correcting blade geometry and sharpening dicing blades

Dicing & Grooving
Wafer
Equipment & parts

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02Overview

The dressing board is manufactured through a sintering process using high-quality resin and multiple abrasive materials. It is an essential consumable for correcting blade geometry and sharpening dicing blades.

Dicing blades require regular dressing to maintain their precision and extend their lifespan.

03Features & Benefits

01Long service life
Manufactured with durable materials and can be customized in various sizes according to customer requirements.
02Excellent dressing performance
After dressing, diamond particles on the blade surface are effectively exposed, resulting in a sharper cutting edge and stable, high-quality dicing.
03Easy operation & control
The dressing process is simple and the amount of dressing is easy to control.

04Applications

Where it fits in wafer dicing

1 PROTECTIVE COATING Water-soluble coating on the wafer before laser processing LG-200
2 LASER GROOVING Laser grooving of the surface layer — chipping, thermal stress and debris prevented
3 BLADE DRESSING – Dressing Board Correct blade geometry and sharpen the dicing blade
4 BLADE DICING Cut into individual dies with the blade
5 DI WATER CLEANING Remove the coating with DI water and dry LG-200

Based on a typical process flow. Actual sequence and conditions vary by customer process.

New dicing blades — pre-treatment removing initial irregularities and creating a sharp edge
Used dicing blades — restoring blade geometry and sharpening dull edges
Wafer dicing · package sawing

Types of dressing boards

Resin Bond

Flexible bond structure providing a smooth and controlled dressing action. Best for precision applications, soft materials and fine-pitch wafer dicing requiring minimal surface damage.

Vitrified Bond

High-rigidity bond with excellent abrasive retention for aggressive dressing and maintaining sharp blade profiles. Ideal for hard materials, high-volume dicing and package sawing.