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Chemicals for PCB

WATER SOLUBLE

Flip chip & BUMP FLUX

        
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1. Description
      CF - Series ´Â NONE-HALOGENÀÇ ÀûÀýÇÏ°í È¿°úÀûÀÎ FLIP CHIP ¿ë FLUX·Î¼­ ¿ì¼öÇÑ
     solderability¿Í ¼ö¼¼Á¤·ÂÀ» °®´Â ¹«¿¬(lead-free) °â¿ë WATER SOLUBLE LIQUID FLUX ÀÔ´Ï´Ù.
 
 
Specification

1)    ÇҷΰռººÐ µî°ú °°Àº °­ÀüÇØÁú ¹°ÁúÀ» ÇÔÀ¯ÇÏÁö ¾ÊÀº È¥ÇÕ¹°ÀÓ¿¡µµ ºÒ±¸ÇÏ°í
   Ư¼ö ¸ÞÄ«´ÏÁò¿¡ ÀÇÇØ È°¼ºÈ­ÇÏ¿© ¾î·Á¿î Á¶°Ç¿¡¼­ÀÇ solderabilityµµ ¾çÈ£ÇÕ´Ï´Ù..
 
2)    µ¶¼ºÀÌ °­ÇÑ ¹°ÁúÀ» ÇÔÀ¯ÇÏÁö ¾Ê°íµµ ¿ì¼öÇÑ ¼¼Á¤·ÂÀ» °¡Áö¹Ç·Î
    °í¿Â ¼Ö´õ¸µ°ú ¼¼Á¤ ÈÄ¿¡ Ç÷°½º Àܻ簡 ³²Áö ¾Ê½À´Ï´Ù.
 
¡¡¡¡3) Cu, Ni, Sn µîÀÇ ±Ý¼ÓÀ» etching ½ÃÅ°Áö ¾ÊÀ¸¸é¼­ »êÈ­¸·¸¸ Á¦°ÅÇÏ¿© 
          solderability¸¦ Çâ»ó½Ãŵ´Ï´Ù.
  ÁÖ¼Ò : °æ±âµµ ºÎõ½Ã Á¶¸¶·ç·Î 385¹ø±æ 80 ÃáÀÇÅ×Å©³ëÆÄÅ© 3Â÷ 1204È£¡¡TEL : 032-222-0601¡¡FAX : 032-222-0602¡¡E-mail : clint5860@chemtechi.com
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